| 配方类型: |
METALS AND TREATMENTS |
| 配方说明: |
Electroless Lead Plating |
| 配方组成: |
Thiourea/35 g Dimethyl sulfoxide/175 ml Lead nitrate/35 g |
| 配制方法: |
At a temperature of 45C a smooth, bright lead deposit was obtained on copper. The authors did not try the method on other basis metals; however, if it is unsuitable on steel, a light copper plate could be applied first. |
|